TensorNova
TensorNova
Explore our flagship xFusion and enterprise rack solutions configured for private cloud deployment, AI virtualization workloads, and high-capacity storage arrays.
As deep learning architectures, such as DeepSeek R1 and large language models (LLMs), transition from experimental labs to core enterprise workflows, public cloud architectures are presenting critical barriers. Data sovereignty, massive recurring GPU instance costs, network latency, and intellectual property leaks are forcing CTOs to pivot. Private cloud solutions offer localized control, dedicated compute allocation, and hardware-level isolation.
Modern private clouds are no longer simple legacy hypervisors running on standard rack mount platforms. Today's architectures require high-density multi-socket node scaling, massive NVMe storage fabrics (NVMe-oF), and advanced GPU-to-GPU interconnect technologies. Without optimal hardware and tailored OEM custom server nodes, scaling these private infrastructures leads to substantial performance degradation and thermodynamic failure.
Leveraging 12+ years of industry experience to deliver fully customized high-performance GPU and cloud computing solutions.
Established in 2016, TensorNova is a professional, high-performance AI GPU server manufacturer and infrastructure solution provider based in China. Specializing in AI computing, GPU clusters, and scalable data center hardware solutions for global enterprises, we bridge the gap between complex hardware configurations and scalable cloud deployment models.
Operating a modern production facility equipped for advanced server assembly, testing, and complex system integration, we drive strict compliance and zero-fault tolerance. Our facility executes thorough quality assurance via ISO9001-based quality management systems. Every server unit undergoes automated hardware stress testing, thermal performance validation, burn-in cycles, and direct AI workload simulation tests before dispatch, supervised by our dedicated team of 45 quality control personnel.
Our robust supply chain ecosystem comprises more than 1,200 global suppliers and strategic component partners. This extensive integration ensures stable production flows, component availability even during chipset shortages, and rapid delivery cycles for high-volume enterprise procurements.
TensorNova records an annual export revenue of approximately $8.5 million, backed by 6 years of export experience. We serve a diverse global client base across North America, Europe, Southeast Asia, and the Middle East, with primary export destinations including the United States, Germany, Singapore, and the United Arab Emirates.
Navigating complex international regulations with hardware-level security, certifications, and compliance frameworks.
Our bespoke private cloud solutions are built from the ground up to support strict compliance protocols, including GDPR in Europe, HIPAA for healthcare integrations, and regional data residency constraints. We implement root-of-trust security modules at the motherboard level to secure data-at-rest and in-transit.
To bypass software dependency vulnerabilities, we offer fully open-source baseboard management controller (BMC) firmware (OpenBMC) configurations. This allows enterprise IT departments to auditing, manage, and monitor server hardware components without proprietary security backdoors.
Our global export infrastructure is paired with certified localization support networks. Through partnerships in North America, Germany, Singapore, and the UAE, we guarantee minimal downtime by arranging fast spare-parts supply, thermal audit consultations, and on-site deployment guidance.
How our 180+ R&D engineering team translates bespoke customer workloads into physical silicon and chassis architectures.
Depending on target applications (e.g., DeepSeek R1 model finetuning vs parallel ray-tracing workloads), we customize PCIe lane switching, PCIe switch topologies, and direct-attach NVLink setups to optimize throughput and cut inter-node latency.
We engineer both highly efficient air-assisted forced convection cooling shrouds and advanced direct-to-chip liquid cooling manifolds. Our thermal simulations match target environmental conditions in modern green data centers.
From physical chassis dimensions (e.g., short-depth server nodes for edge cloud nodes) to custom power supply unit (PSU) redundancy configurations (such as 1+1 or 2+2 setups up to 2000W+), we offer complete ODM flexibility, including custom enterprise paint and logo branding.
Where customized high-performance computing systems are deployed across various industries.
Perfect for research labs running local LLM training, reinforcement learning, and large neural network calculations in secure environments where public clouds pose copyright risks.
Fully audited hardware nodes running OpenBMC firmware, compliant with government data protection regulations, and configured with physical intrusion detection systems.
Engineered for hypervisors running virtualized enterprise resource planning (ERP) databases, high-capacity NAS, and web microservices with low internal latencies.
Staying ahead of industry changes with our active R&D pipeline and next-generation designs.
Memory pooling via CXL is set to revolutionize private clouds by allowing CPUs and accelerators to share a dynamic pool of memory, dramatically lowering system overhead and increasing flexibility.
As CPU TDP moves past 350W and GPUs reach 700W+, direct liquid cooling is transitioning from a premium upgrade to a core server requirement to prevent thermal throttling.
Security is moving down the stack. Future architectures will rely on secure enclaves and encryption directly in the hardware, ensuring protection against complex rootkits.
Private clouds are shifting toward a hybrid model, utilizing rugged edge nodes to preprocess data before sending selected sets back to central data centers.
Answers to common technical, shipping, and customization inquiries from procurement departments.
We support modifications to PCIe bus topologies, customized GPU tray designs (supporting from 4 up to 8 GPU boards in a 4U/8U configuration), specialized thermal heatsink dimensions, and custom power distribution cards configured for variable power parameters.
Every server manufactured undergoes rigorous, multi-hour burn-in procedures, thermal performance validation in controlled environments, and simulated deep learning training runs (e.g., executing training scripts for model runs) to ensure absolute stability under maximum operational capacity.
Yes, we can flash and configure fully open-source OpenBMC firmware to replace proprietary baseboard management solutions. This ensures complete auditability and helps meet strict governmental and corporate security requirements.
Depending on component availability and customization requirements, standard lead times range from 4 to 6 weeks. Leveraging our strong supply network of 1,200+ partners helps us keep production timelines short, even during peak market demand.
We optimize memory bandwidth and cache allocation across multi-GPU setups to handle the massive context sizes and high parallel processing demands of reasoning-focused models like DeepSeek R1, preventing system slowdowns.
Browse our high-density storage nodes, flash upgrades, and rack servers optimized for virtualization host environments.
